Schott is also able to supply low temperature cofired ceramic ltcc housings through its partnership with via electronic.
Ltcc ceramic package.
Ceramic packages for automotive electronics.
Optical packages htcc is a practical choice or optical applications packages due to hermeticity flatness capability and stable over a wide temperature range.
Agcu eutectic or low temperature soldering e g.
Surface mount ceramic packages for electronic devices.
Ceramic packages for light emitting diodes leds ltcc packages for rf modules.
Ltcc low temperature co fire ceramics is a multi layer glass ceramic substrate which is co fired with low resistance metal conductors at low firing temperature less than 1000.
Ceramic packages for power electronics.
It is sometimes referred to as glass ceramics because its composition consists of glass and aluminum.
Htcc components generally consist of multilayers of alumina or zirconia with platinum tungsten and molymanganese metalization.
Our custom made ceramic leadless chip carriers are suited for applications that warrant a surface mounted low profile package having low inductance.
Ltcc also features the ability to embed passive elements such as resistors capacitors and inductors into the ceramic package minimising the size of the completed module.
Ceramic packages for mems sensors.
A low cost multilayer low temperature co fired ceramic ltcc package based on a mass production design rule for an mmic up to w band has been developed.
2 3 low cost multilayer ceramic package for flip chip mmic up to w band.
Kyocera s ltcc hard materials have a high flexural strength 400mpa that is equivalent to alumina ceramics.
High reliability ceramic substrates ltcc htcc.
High lead count packages.
Ltcc substrate with embedded passive components.
Ceramic packages and optical filters for image sensors.
The package structure includes a cavity for the flip chip mmic and improved coplanar feed through to suppress radiation.
Components for fiber optic connectors.
For htcc a final metal coating e g.
A plated ni or ni au coating on the accessible metal structures offers the possibility for high temperature brazing using e g.
Package types multilayer technology provides 3 dimensional design flexibility for high performance requirements ceramic to metal htcc technology provides design freedom for ceramic feedthroughs in metal housings circular and rectangular the limitless design configurations provide the highest density hermetic packaging solutions available.
Ausn eutectic process steps.
They offer excellent resistance to the shock of drop testing and are well suited as module substrate materials in mobile communication devices.
High strength materials ltcc hard.
The multilayer ceramic is co fired at high temperatures to form a solid and hermetic ceramic.
